Advanced Packaging Market

In 2022, the Global Advanced Packaging Market reached a value of $29.42 billion and is projected to reach $64.19 billion by 2030, with a compound annual growth rate (CAGR) of 10.2% from 2023 to 2030.

Advanced packaging plays a crucial role in safeguarding silicon wafers, logic units, and memory from physical damage and corrosion during the final stages of semiconductor manufacturing. It enables the connection of chips to circuit boards. Various techniques are employed in advanced packaging, including 2.5D, 3D-IC, fan-out-wafer-level packaging, and system-in-package.

With the rapid growth of the advanced packaging market, particularly in fan-out wafer level packaging, coupled with the increasing demand for smartphones, devices, and the Internet of Things (IoT), suppliers are focusing on developing processes and methods to reduce overall costs and enhance operational efficiency in advanced packaging. While advanced packaging is currently prevalent in high-end products and niche-market applications such as wafer and die production due to its higher operational costs, different integrated circuits (ICs) have varying packaging requirements, presenting growth opportunities for advanced packaging over traditional packaging processes. Furthermore, advanced packaging is expected to offer superior capabilities compared to conventional packaging solutions, creating lucrative opportunities for the market in the coming years.

The Global Advanced Packaging Market is analyzed based on type, end use, and region. The types of advanced packaging include flip chip CSP, flip-chip ball grid array, wafer level CSP, 2.5D/3D, fan-out WLP, and others. The market is segmented by end use into consumer electronics, automotive, industrial, healthcare, aerospace & defense, and others. Regionally, the market is analyzed across North America, Europe, Asia-Pacific, and LAMEA, including their prominent countries.

Top Impacting Factors
The global advanced packaging market growth is influenced by several significant factors. One of these factors is the increasing demand for device miniaturization, as well as improved system performance and optimization offered by advanced packaging solutions. However, the high cost associated with advanced packaging has been a hindrance to its widespread adoption, which has affected the market's growth. Conversely, the emerging trend of fan-out wafer level packaging presents promising opportunities for the advanced packaging market in the forecast period.

One of the major factors impacting the growth of the advanced packaging market is the growing demand for device miniaturization. Advancements in technology have led manufacturers to focus on providing compact electronic devices across various industry verticals such as consumer electronics, healthcare, automotive, and semiconductor IC manufacturing. These manufacturers are striving to reduce the size of integrated circuits to enable fine patterning on wafers and chips. Additionally, the medical devices industry is witnessing an increased demand for nano-sized robotic surgery equipment, as well as advancements in wearable and personalized healthcare gadgets. Consequently, the trend towards compact electronic devices has created a need for designers to move beyond traditional packaging solutions and adopt advanced packaging methods.

Improved system performances and optimization of advanced packaging
The semiconductor packaging industry plays a vital role in the development of next-generation chip designs by providing advanced IC packages. Traditionally, the integrated circuit industry relied on conventional chip scaling and innovative architectures for new devices. Furthermore, the prevalence of multi-chip packages in phones, data centers, consumer electronics, and networks has fueled the growth of advanced packaging, as it enables system optimization. Advanced packaging also facilitates the utilization of AI, machine learning, and deep learning by allowing different processing elements and memories to be integrated using high-speed interconnects. As a result, various industry verticals, including automotive, healthcare, aerospace & defense, and the industrial sector, are increasingly adopting advanced packaging to benefit from enhanced operational capabilities and precise processing.

However, the adoption of advanced packaging is hindered by its high cost. Compared to conventional packaging solutions used in the semiconductor industry, advanced packaging is a significantly more expensive process. The cost of designing and manufacturing chips at each new node is substantial, and the complexities involved in IC wafer fabrication contribute to higher costs. Additionally, the packaging of different chips and ICs with intricate patterning further increases the overall cost of advanced packaging, impeding its wider adoption.

Market Segmentation:
By Type
• Flip Chip CSP
• Flip-Chip Ball Grid Array
• Wafer Level CSP
• 5D/3D
• Fan Out WLP
• Others

By End Use
• Consumer Electronics
• Automotive
• Industrial
• Healthcare
• Aerospace & Defense
• Others

Competition Analysis
Prominent players with significant market share in the advanced packaging industry include Amkor Technology, Intel Corporation, Qualcomm Technologies Inc., Taiwan Semiconductor Manufacturing Company, IBM, Microchip Technology, Renesas Electronics Corporation, Texas Instruments, and Analog Devices, among others. These key market players are profiled in detail within this report and employ various strategies such as product launches, product development, collaborations, partnerships, and agreements to drive market growth.

Key Benefits for Stakeholders:
• This study provides an analytical overview of the global advanced packaging market, including its size, current trends, and future estimations, highlighting potential investment opportunities.
• The analysis aims to identify profitable trends in the advanced packaging market, assisting stakeholders in establishing a stronger market presence.
• The report offers insights into the key drivers, restraints, and opportunities in the advanced packaging industry, accompanied by a detailed impact analysis.
• Quantitative analysis of the current advanced packaging market forecast from 2022 to 2030 enables financial benchmarking and assessment of market competency.
• Porter's five forces analysis evaluates the bargaining power of buyers and suppliers within the advanced packaging market.